♦ Maximum Capacity: 1.5kN/300 lbf
♦ Minimum Loadcell: 50N/10lbf
♦ Maximum sample width: 50mm/2in
♦ Maximum sample length: 150mm/5.9in
♦ Test plate length: 177mm/7in
♦ Temperature Limits: -20 to 100°C
Specifically designed for peel testing the bond between copper and PCBs
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