YXLON FF65 CL

World’s best resolution 3D X-ray inspection system for fully automated verification of IC packaging defects

Semiconductor manufacturing requires automated, high quality, reliable, fast and non-destructive inspection and analysis for an optimum production as defects can be found on the wafer, on a substrate, on a strip or in the subassembly of a final device.

The new X-ray inspection system YXLON FF65 CL has especially been designed to provide the best automatic analysis of smallest and most demanding features within the 3D IC, MEMS and sensors. The result: impressively precise and reproducible test and inspection excellence.

High-speed 3D AXI brings about a revolution in the semiconductor process management
Most precise measurements of defect dimensions for advanced 3D IC packeging, MEMS and Sensors
Best reliable and reproducible check of process conditions and defect parameters
Leading-edge simple and easy operation with fully automated wafer handling and testing process

Manufacturer

Yxlon

Testing

NDT

System Capabilities

The perfect solution for high-volume, automated and reliable semiconductor joint analysis

The YXLON FF65 CL is distinguished by its large inspection area of 510 x 610 mm and the detectability of < 300 nm, making it ideal for automatically and non-destructively analyzing solder bumps and filled vias in 3D ICs, flip chips and wafers. The innovative vacuum mechanism of the system manipulator holds the sample securely and precisely during analysis and counteracts the effects of sample warpage.

The FF65 CL provides 2D (top-down) with a high-performance flat-panel and 3D (CL – Computed Laminography) automated analysis using a high-resolution Image Intensifier within a special manipulation assembly for its inclined rotations.The latest generation of nano-focus X-ray tubes creates 2D and 3D images that can reveal and measure the smallest voids and features. This enables the YXLON FF65 CL to analyze the most demanding advanced semiconductor challenges.

A user-friendly and intuitive graphical user interface (GUI) allows the easy creation of automated, multi-point and multi-functional analysis inspection programs.

Measurement repeatability over time is ensured by automatic, continuously monitoring background calibration tests over all aspects of the system.

Technical Data

Attribute	Respective Value
Sample Diameters	795 [mm] (30.1″)
Sample Height	20 [mm] (0.7″)
Maximum Sample Weight	2 [kg]
System Dimensions	1760 x 2000 x 2000 [mm]
CT Modes	Super-high resolution Computed Laminography (CL)
Manipulation	Super-precise manipulator, active anti-vibration system, highest reliability

Manufacturer	Yxlon
Testing	NDT

Description
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Description

Attribute	Respective Value
Sample Diameters	795 [mm] (30.1″)
Sample Height	20 [mm] (0.7″)
Maximum Sample Weight	2 [kg]
System Dimensions	1760 x 2000 x 2000 [mm]
CT Modes	Super-high resolution Computed Laminography (CL)
Manipulation	Super-precise manipulator, active anti-vibration system, highest reliability